- Design of single-layered, double-layered and multilayer boards.
- Testing requirements for the electric, electromagnetic, mechanical and
thermal characteristics of boards.
- Detailed design with attention to the peculiarities of printed circuit
assembly (technological peculiarities of installation and methods of components
soldering on a printed board, including surface mounting technology.
- Use of elements for creation of connection layout according to USCD of own
design (more than 1000 components).
- Multitude of additional modules, which are necessary to provide the
customers inquiries: aligners of different interfaces, test and bench-top
devices, etc.
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